Amtech SynTECH-LF TF Very low global warning potential Keep the solder paste container

Keep the solder paste container sealed while warming the solder paste to operating temperature

so cleaning is not required to meet IPC standards

7Cu 227 441 95Sn/%sB 235-240 455-464 95Sn/5Ag 221-245 430-473 Test Results

nonflammability and constant composition during boiling of Novec 71IPA fluid make it ideal for precision and specialty cleaning and rinsing for removal of particulate

Amtech SynTECH-LF TF Very low global warning potential Keep the solder paste containerTechnical Data Sheet Safety Data Sheet Amtech SynTech LF TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. Amtech SynTECH LF TF may be used for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites. Product Highlights ROL0 flux classification Wide process window Excellent wetting compatibility on most board finishes Clear residue Low