K‑Bond Universal – Light‑Cured Universal Bonding Agent Packaging:5 mL Bottle When used with modern nano-hybrid

When used with modern nano-hybrid composites such as EsCom 250

⭐ Disposable Tip Workflow

Enables accurate delivery of intracanal materials

Processed to remove organic components while preserving natural mineral structure and trabecular framework

K‑Bond Universal – Light‑Cured Universal Bonding Agent Packaging:5 mL Bottle When used with modern nano-hybridAn 8th generation, light cured universal bonding agent engineered for clinical flexibility across total etch, selective etch, and self etch protocols in both direct and indirect restorative procedures. Triple Etch Protocol Compatibility Designed for seamless integration with total etch, selective etch, and self etch techniques, supporting adaptable clinical decision making. Dual Cure & Indirect Compatibility Formulated to support bonding in both light